A fast active optical photonics alignment system based on a compact motorized XYZ stage (L-505) and a high-speed XYZ piezo scanner (P-616). A high level controller with internal alignment routines ...

Olympus Integrated Technologies America presented its 3D-ICautomated metrology system at SEMICON West 2010. The system provides preciseimaging to verify the alignment of bonded wafers and TSVs ...

Semiconductor manufacturing depends heavily on the ability of machine-vision systems to correctly locate, identify, and align wafers and circuits for testing. Inaccuracy in any of these activities can ...

The precision required poses several challenges for testing and packaging procedures, necessitating the precise alignment of fiber optic devices in high-throughput production settings. PI offers ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...

Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...