Abstract: Accurate and efficient modeling of lateral double-diffused MOS (LDMOS) devices is critical for process optimization and reliability analysis, especially under limited simulation budgets.
Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3D finite ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results