The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. By removing time-consuming manual steps, the tool streamlines the ...
Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Abstract: Embedded multi-die interconnect bridge (EMIB) is a significant packaging technology platform currently in high-volume production, offering high-density, and localized in-package ...
Lumerical empowers component designers with high performance software solutions to create next-generation optical, photonic, and electromagnetic technologies correctly the first time. We are the ...
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