The Package Thermal Analysis Calculator (PTA) aids in the analysis of the thermal properties of integrated circuit packages. These include thermal resistance, power dissipation, and die, package, and ...
In materials science, thermal testing refers to the process of subjecting materials to analysis through thermal control in order to collect data on a wide range of properties. Generally, thermal ...
Dielectric thermal analysis (DETA) is a materials science technique in which an oscillating electric field is used to analyze changes in the physical properties of a number of polar materials. This ...
Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of ...
The Thermal Analysis (VITA) module enables nanoscale thermal analysis (nTA), a novel technique that allows the determination of the local transition temperature on the surface of a material with ...
With the increasing complexity and power dissipation of modern electronic designs, controlling peak temperature and predicting the temperature profile on the chip early in the process is becoming ...
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