A virtual DOE-based process sensitivity check was performed for two tiers of channel holes in a 3D NAND device. The channel hole tilt distance, twist angle, and their sensitivities to the visible area ...
Since about 2015, when Don Bartusiak, the then chief engineer at ExxonMobil Research & Engineering, publicly advocated for the development of a new, standards-based, open—yet secure—process control ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Honeywell and Danfoss are partnering to integrate variable frequency drive (VFD) technology with Honeywell's Experion Process Knowledge System platform to streamline motor control, reduce energy ...
Miniaturization and automation are bringing new tools and strategies to cell-culture process development for production of therapeutic proteins. In addition to automating existing culture platforms ...
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